Dorazil Mikro-Elektronik GmbH, Development, Manufacturing and Services for Hybrid Circuits in thick and thin film, Multichipmodules (MCM's), Chip on Board (COB), Flip Chip, Assembly Service Mikroelektronik, Elektronik, SMD, Bonden, Drucken, SMT, Hybride, Dickschicht, Dünnfilm, Thinfilm, Thickfilm, MCM, COB, Chip on Board, Multichipmudul, Mikrosysteme, Flip Chip, Flipchip, Flip-Chip, Bestückung, Bestückungsservice, Entwicklung, Layout, Design, Substrat, Leiterplatte, Dorazil, Assembly, Assembly Service, Wafer, Bumps, Ball Grid Array, Circuit, kundenspezifische Hybride, customerspecific hybrid circuits, Löthybride, Chip and Wire, Microelectronic, Flachbaugruppen, Dickschichthybride, Dünnfilmhybride, Hybridhersteller, Hybrid-Hersteller, Chipbestücken, Chipmontage, Optohybride, Opto-Hybride, Mikrosystemtechnik Dorazil-Logo
  Dorazil Mikro-Elektronik GmbH German
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Production
Screenprinting Screenprinting
Air-Conditioned rooms with stable temperature, constant air humidity and filtered air supply, achieved cleaning degree class C1.000 Single- and Multiscreenprinting through-plated conductions, Fineline printing (up to 80µm).
Screenprinting-Control Screenprinting - Control
Optical control of substrates directly after the printing occurence.
Solder-Printing Solder - Printing
Halfautomatic solder printing, optical 2D 3D Measurement, precision up to 2µm exactly. Only finepitch-suited kind of solder are used.
SMD-Assembly SMD-Assembly
Smallest size 0402 All SMD-cases for BGA's, Micro-BGA's and Flip-Chips QFP's up to a connection screen of 0,254mm proceeding secured. SMD- connectors up to 150mm length Assembly of exotic components Assembly of flexible or starr-flexible PCB's and of course ceramic substrates.
Interior View Interior View
of an armed assembling automat (2Head-High-Precision-Automat). Centering of defined components per laser, precision up to 10µm exactly.
Reading Reading
of BOC-Marks per infra-redlight-camera to the comparision of tolerances with Multi-up PCB's allowing a continously high assembling precision.
Hand Assembly Hand Assembly
Conventionel Components are assembled at especially protected and antistatic secured working stations with high functionality integration.
Bonding Department Bonding Department
Air-Conditioned rooms with stable temperature, constant air humidity and filtered air supply, achieved cleaning degree class C1.000 Ultrasonic - Wedge-Wedge - Proceeding Aluminum-thin wire bonding Gold-thin wire bonding (heated admission) Maximal wire-strength: 50µm.
Bondprocess Bondprocess
with proceeding control. The bonding automat from the manufacturer F&K Delvotec is owning a controlling mechanism, which is able to show incorrect (possible faulty) parameter with every single wire. This guarantees a continously high quality standard.
Die-Bonding Die-Bonding
per automat with high precision, up to 1µm exactly! Die Bonding of Micro-Chips, Flip-Chips and also Asics, from Wafers or from Wafflepacks, both are possible.
Testing area Testing area
Incircuit-Test, Stand Alone, Passive and active Components, IC's, Reliability Test, Burn- In, Run- In, Security Tests (f. e. VDE).
Test of Functionality Test of Functionality
Inline, Stand Alone, Customerspecific partition testing or complete functionality testing.
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